A NOVEL-APPROACH - THERMOPLASTIC DIE ATTACH ADHESIVE

被引：0
|
作者：
YING, L [1 ]
机构：
[1] M&T CHEM INC,RAHWAY,NJ
来源：
SOLID STATE TECHNOLOGY | 1987年 / 30卷 / 09期
关键词：
DIES; -; Adhesion; THERMOPLASTICS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A novel approach to die bonding using a thermoplastic adhesive is described. The thermoplastic adhesive, which requires no cure, offers a number of advantages in die attach applications. There is also a discussion of other die bonding materials such as gold-silicon eutectic, epoxy and polyamic acid products currently available on the market.
引用
收藏
页码：107 / 109
页数：3
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