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- [1] Cyanate ester die attach material for radiation hardened electronic packages 3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, : 49 - 54
- [2] Epoxy Adhesive as Die Attach Material in Semiconductor Packaging: A Review PROCEEDINGS OF THE 2018 INTERNATIONAL CONFERENCE ON APPLIED ENGINEERING (ICAE), 2018,
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- [4] Low stress polymer die attach adhesive for plastic packages 1995, Morgan-Grampian plc, London, United Kingdom (67):
- [5] Novel cyanate ester resin composites for microelectrical packaging Xue, J. (xuejie@suda.edu.cn), 1600, Beijing Institute of Aeronautical Materials (BIAM)
- [8] LOW-STRESS POLYMER DIE ATTACH ADHESIVE FOR PLASTIC PACKAGES ELECTRONIC ENGINEERING, 1995, 67 (818): : 41 - &
- [9] Die Attach for Microelectronic Packaging: Copper Paste Comparison Between Pressure and Pressureless Techniques 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
- [10] Novel Silver Contact Paste Lead Free Solution for Die Attach INTERNATIONAL EXHIBITION AND CONFERENCE FOR POWER ELECTRONICS, INTELLIGENT MOTION AND POWER QUALITY 2010 (PCIM EUROPE 2010), VOLS 1 AND 2, 2010, : 940 - 945