A NOVEL-APPROACH - THERMOPLASTIC DIE ATTACH ADHESIVE

被引：0

作者：

YING, L ^{[1
]}

机构：

[1] M&T CHEM INC,RAHWAY,NJ

来源：

SOLID STATE TECHNOLOGY | 1987年 / 30卷 / 09期

关键词：

DIES; -; Adhesion; THERMOPLASTICS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel approach to die bonding using a thermoplastic adhesive is described. The thermoplastic adhesive, which requires no cure, offers a number of advantages in die attach applications. There is also a discussion of other die bonding materials such as gold-silicon eutectic, epoxy and polyamic acid products currently available on the market.

引用

页码：107 / 109

页数：3

共 50 条

[41] Effect of Die Attach Adhesive Defects on the Junction Temperature Uniformity of LED Chips
Tao, Mian
Lee, S. W. Ricky
Yuen, Matthew M. F.
Zhang, Guoqi
van Driel, Willem
2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
[42] A NOVEL-APPROACH TO THE SYNTHESIS OF ENEDIYNES
MAGRIOTIS, PA
SCOTT, ME
KIM, KD
TETRAHEDRON LETTERS, 1991, 32 (43) : 6085 - 6088
[43] STATISTICS MASTERY - A NOVEL-APPROACH
WARD, EF
TEACHING OF PSYCHOLOGY, 1984, 11 (04) : 223 - 225
[44] CATHETER CLAMPING - A NOVEL-APPROACH
OGHIA, H
FERNANDEZ, R
ADDONIZIO, JC
UROLOGY, 1985, 26 (01) : 74 - 75
[45] A NOVEL-APPROACH TO SEQUENTIAL SIMULATION
KUMAR, D
IEEE SOFTWARE, 1986, 3 (05) : 25 - 33
[46] A NOVEL-APPROACH TO AN UNCOMMON CONDITION
BERGMAN, MM
CIAK, CS
HOSPITAL PRACTICE, 1989, 24 (08): : 37 - 42
[47] NOVEL-APPROACH TO DIGITAL BEAMFORMING
PRIDHAM, RG
MUCCI, RA
JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 1978, 63 (02): : 425 - 434
[48] A NOVEL-APPROACH TO THE HISTRIONICOTOXIN FRAMEWORK
PARSONS, PJ
ANGELL, R
NAYLOR, A
TYRELL, E
JOURNAL OF THE CHEMICAL SOCIETY-CHEMICAL COMMUNICATIONS, 1993, (04) : 366 - 367
[49] DEMONS IN SIMULATION - A NOVEL-APPROACH
JAVOR, A
SYSTEMS ANALYSIS MODELLING SIMULATION, 1990, 7 (05): : 331 - 338
[50] NOVEL-APPROACH TO BOUNDARY FINDING
SHANN, RT
OAKLEY, JP
IMAGE AND VISION COMPUTING, 1990, 8 (01) : 32 - 36

← 1 2 3 4 5 →