CORROSION FAILURE MECHANISMS FOR GOLD METALLIZATIONS IN ELECTRONIC CIRCUITS

被引：32

作者：

FRANKENTHAL, RP ^{[1
]}

BECKER, WH ^{[1
]}

机构：

[1] BELL TEL LABS INC, READING, PA 19604 USA

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1979年 / 126卷 / 10期

关键词：

D O I：

10.1149/1.2128783

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：1718 / 1719

页数：2

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