GOLD CHROMIUM METALLIZATIONS FOR ELECTRONIC DEVICES

被引：0
|
作者：
HOLLOWAY, PH
机构：
来源：
SOLID STATE TECHNOLOGY | 1980年 / 23卷 / 02期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The thin films of gold which are applied so extensively in electronic devices are normally deposited over thin films of other metals in two, three or even four component metallization systems. The problems arising in such systems are illustrated in this article on the gold/chromium metallization system developed in large measure at the Sandia Laboratories in Albuquerque, New Mexico.
引用
收藏
页码：109 / 115
页数：7
相关论文
共 50 条
  • [1] CORROSION FAILURE MECHANISMS FOR GOLD METALLIZATIONS IN ELECTRONIC CIRCUITS
    FRANKENTHAL, RP
    BECKER, WH
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (10) : 1718 - 1719
  • [2] Gold/niobium thin film metallizations for GaAs devices and circuits
    Esser, R
    Christou, A
    THIN FILMS: STRESSES AND MECHANICAL PROPERTIES IX, 2002, 695 : 297 - 302
  • [3] ELECTROLYTIC CORROSION OF GOLD - APPLICATION TO METALLIZATIONS IN ELECTRONIC-CIRCUITS
    FRANKENTHAL, RP
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1984, 131 (08) : C300 - C300
  • [4] CORROSION FAILURE MECHANISMS FOR GOLD METALLIZATIONS
    FRANKENTHAL, RP
    BECKER, WH
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1978, 125 (08) : C359 - C359
  • [5] Electrostatic adhesion testing of electronic metallizations
    Yang, HS
    Brotzen, FR
    Callahan, DL
    Dunn, CF
    REVIEW OF SCIENTIFIC INSTRUMENTS, 1997, 68 (06): : 2542 - 2545
  • [6] Gold metallizations for eutectic bonding of silicon wafers
    Lani, S.
    Bosseboeuf, A.
    Belier, B.
    Clerc, C.
    Gousset, C.
    Aubert, J.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2006, 12 (10-11): : 1021 - 1025
  • [7] Gold metallizations for eutectic bonding of silicon wafers
    S. Lani
    A. Bosseboeuf
    B. Belier
    C. Clerc
    C. Gousset
    J. Aubert
    Microsystem Technologies, 2006, 12 : 1021 - 1025
  • [8] Recycling of gold from waste electronic components of devices
    Panda, Rekha
    Dinkar, Om Shankar
    Jha, Manis Kumar
    Pathak, Devendra Deo
    KOREAN JOURNAL OF CHEMICAL ENGINEERING, 2020, 37 (01) : 111 - 119
  • [9] Recycling of gold from waste electronic components of devices
    Rekha Panda
    Om Shankar Dinkar
    Manis Kumar Jha
    Devendra Deo Pathak
    Korean Journal of Chemical Engineering, 2020, 37 : 111 - 119
  • [10] ALLOYING OF GOLD AND GOLD ALLOY OHMIC CONTACT METALLIZATIONS WITH GALLIUM-ARSENIDE
    MILLER, DC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1978, 125 (03) : C147 - C147
12345