GOLD CHROMIUM METALLIZATIONS FOR ELECTRONIC DEVICES

被引：0
|
作者：
HOLLOWAY, PH
机构：
来源：
SOLID STATE TECHNOLOGY | 1980年 / 23卷 / 02期
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The thin films of gold which are applied so extensively in electronic devices are normally deposited over thin films of other metals in two, three or even four component metallization systems. The problems arising in such systems are illustrated in this article on the gold/chromium metallization system developed in large measure at the Sandia Laboratories in Albuquerque, New Mexico.
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页码：109 / 115
页数：7
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