THIN-FILM HYBRID INTEGRATED-CIRCUITS FOR COMMUNICATION SYSTEMS

被引：1

作者：

ORR, WH

ROBILLAR.TR

机构：

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1972年 / PHP8卷 / 02期

关键词：

D O I：

10.1109/TPHP.1972.1136560

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：51 / &

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