THIN-FILM HYBRID CIRCUITS

被引：0

作者：

BERNER, G

BURKARD, H

机构：

来源：

BROWN BOVERI REVIEW | 1980年 / 67卷 / 10期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：614 / 617

页数：4

共 50 条

[1] THIN-FILM HYBRID CIRCUITS
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[J]. INTERNATIONAL JOURNAL OF ELECTRONICS, 1978, 44 (01) : 41 - 48
[2] ASSEMBLY AND BONDING OF THIN-FILM HYBRID CIRCUITS
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[J]. WESTERN ELECTRIC ENGINEER, 1969, 13 (01): : 2 - &
[3] THIN-FILM RESISTOR NETWORKS IN HYBRID CIRCUITS
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[J]. SOLID STATE TECHNOLOGY, 1977, 20 (03) : 45 - 49
[4] TECHNOLOGY OF THIN-FILM HYBRID MICROWAVE CIRCUITS
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[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1976, 12 (04): : 304 - 309
[5] CUSTOM DESIGN OF THIN-FILM HYBRID CIRCUITS
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[J]. ELECTRONIC ENGINEERING, 1970, 42 (508): : 63 - &
[6] MATERIALS CONTROL FOR MANUFACTURE OF THIN-FILM HYBRID CIRCUITS
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[J]. SOLID STATE TECHNOLOGY, 1975, 18 (05) : 34 - 41
[7] THIN-FILM CIRCUITS
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[J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1983, 10 (2-3): : 185 - 189
[9] OPTIMAL SYNTHESIS OF COMPONENT TOLERANCES FOR THIN-FILM HYBRID CIRCUITS
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[10] TESTING AND RELIABILITY OF THROUGHPLATINGS IN THIN-FILM HYBRID-CIRCUITS
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[J]. F&M-FEINWERKTECHNIK & MESSTECHNIK, 1981, 89 (05): : 209 - 213