HIGH-CURRENT PRESSURE CONTACTS TO AG PADS ON THIN-FILM SUPERCONDUCTORS

被引:2
|
作者
GOODRICH, LF
SRIVASTAVA, AN
STAUFFER, TC
ROSHKO, A
机构
[1] Electromagnetic Technology Division, National Institute of Standards and Technology, Boulder, CO 80303
关键词
D O I
10.1109/77.291692
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
High current, low resistance, nonmagnetic, and nondestructive pressure contacts to Ag pads on YBa2Cu3O7-delta (YBCO) thin film superconductors were developed in this study. The contact resistance reported here includes the resistance of the current lead/Ag pad interface, the Ag pad/YBCO interface, and the bulk resistance of the contact material. This total contact resistance is the relevant parameter which determines power dissipation during critical-current measurements. It was found that regardless of the optimization of the Ag pad/YBCO interface through annealing, a pressure contact can yield a lower total resistance than a soldered contact. The lowest resistance obtained with pressure contacts was 3 mu Omega (for a 2 x 4 mm(2) contact). These contacts may be useful for many different high temperature superconductor (BTS) studies where high-current contacts with low heating are needed.
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页码:61 / 64
页数:4
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