A SMALL MULTICATHODE MAGNETRON FOR DEPOSITING MULTILAYER THIN-FILM COATINGS

The magnetron can be used to sputter three materials both concurrently and separately. At a target-substrate separation of 100-120 mm, the deviation in the film thickness over an area with a diameter of 40 mm is less than 5% and with a diameter of 76 mm it is less than 10%. Under argon at a pressure of 0.5-0.8 Pa and a discharge current of 0.1-0.5 A each cathode unit provides a deposition rate of 0.05-0.2 mum/min. By selecting the magnetic system configuration and dimensions of the target, we reached an efficiency of 35-40%.