DIE ATTACH MATERIALS AND METHODS

被引：0
|
作者：
TRIGWELL, S
机构：
[1] Surface Science Lab, Mountain View, United States
来源：
SOLID STATE TECHNOLOGY | 1995年 / 38卷 / 04期
关键词：
Bonding - Composition - Eutectics - Failure analysis - Glass - Gold alloys - Melting - Phase diagrams - Reliability - Semiconducting silicon - Semiconductor materials - Soldering alloys;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This article discusses various die attach materials and methods and reviews die attach bonding mechanisms. Failure modes, reliability issues, and test and characterization methods are summarized.
引用
收藏
页码：63 / &
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