FAN-OUT FILTERS

被引:0
|
作者
FRITZEMEYER, RD
机构
来源
ELECTRO-TECHNOLOGY | 1966年 / 77卷 / 04期
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:36 / +
页数:1
相关论文
共 50 条
  • [11] FUTURE OF EMBEDDING AND FAN-OUT TECHNOLOGIES
    Tummala, Rao
    Sundaram, Venky
    Raj, Pulugurtha M.
    Smet, Vanessa
    2017 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC), 2017,
  • [12] Quantum circuits with unbounded fan-out
    Hoyer, P
    Spalek, R
    STACS 2003, PROCEEDINGS, 2003, 2607 : 234 - 246
  • [13] Fan-out and fan-in properties of superconducting neuromorphic circuits
    Schneider, M. L.
    Segall, K.
    JOURNAL OF APPLIED PHYSICS, 2020, 128 (21)
  • [14] An empirical study of fan-in and fan-out in Java OSS
    Nasseri, E.
    Counsell, S.
    Tempero, E.
    8th ACIS International Conference on Software Engineering Research, Management and Applications, SERA 2010, 2010, : 36 - 41
  • [15] Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package
    Shih, Mengkai
    Huang, Chih-Yi
    Chen, Tsan-Hsien
    Wang, Chen-Chao
    Tarng, David
    Hung, C. P.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (09): : 1765 - 1775
  • [16] Integration of Foundry MIM Capacitor and OSAT Fan-Out RDL for High Performance RF Filters
    Lee, Pao-Nan
    Hsieh, Yu-Chang
    Lo, Hung-Lun
    Li, Chang-Ho
    Huang, Fan-Hsiu
    Lin, James
    Hsu, Wei-Chu
    Wang, Chen-Chao
    IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1310 - 1315
  • [17] Experimental and Numerical Investigations of the Warpage of Fan-Out Wafer-Level Packaging With SAW Filters
    Li, Wei
    Yu, Daquan
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (05): : 869 - 877
  • [18] FAN-OUT CONSIDERATIONS OF DIGITAL OPTICAL CIRCUITS
    TOOLEY, FAP
    APPLIED OPTICS, 1987, 26 (09): : 1741 - 1744
  • [19] A Useful Technique to Fabricate Fan-out Grating
    WANG Ququan 1 ZHAO Tongyun 1 XIONG Guiguang 1 ZHOU Zhengguo 1 TIAN Decheng 1
    2 International Center for Material Physics
    Chinese Journal of Lasers, 1998, (06) : 68 - 70
  • [20] Approach with Large Panel Fan-Out Technology
    Shen, Ping-Ching
    Huang, Sheng-Feng
    Yang, Ping-Feng
    Fang, Jen-Kuang
    2024 International Conference on Electronics Packaging, ICEP 2024, 2024, : 175 - 176