NEW FABRICATION FACILITIES FOR PRINTED-CIRCUIT BOARDS

被引：0

作者：

AUGSBURG, G ^{[1
]}

HOFFMANN, M ^{[1
]}

WUNSCHE, H ^{[1
]}

机构：

[1] SIEMENS AG,GERATEWERK,D-8520 ERLANGEN,FED REP GER

来源：

SIEMENS REVIEW | 1977年 / 44卷 / 10期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：465 / 468

页数：4

共 50 条

[1] New Fabrication Facilities for Printed-Circuit Boards.
Augsburg, Gunter
Hoffman, Manfred
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[J]. Siemens-Zeitschrift, 1976, 50 (04): : 222 - 224
[2] PROCESS CONSIDERATIONS IN THE FABRICATION OF FLUOROPOLYMER PRINTED-CIRCUIT BOARDS
LIGHT, DN
WILCOX, JR
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (01): : 118 - 126
[3] POLYETHERIMIDE FOR PRINTED-CIRCUIT BOARDS
GOING, TJ
[J]. INDUSTRIAL FINISHING, 1983, 59 (03): : 35 - 35
[4] DESIGNING PRINTED-CIRCUIT BOARDS
MCGRATH, RA
[J]. COMPUTER GRAPHICS WORLD, 1985, 8 (09) : 69 - &
[5] NEW APPROACHES FOR SOLDER COATING PRINTED-CIRCUIT BOARDS
LANGAN, JP
[J]. PLATING AND SURFACE FINISHING, 1985, 72 (11): : 54 - 54
[6] PROTOTYPE PRINTED-CIRCUIT BOARDS IN A DAY
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WOLF, P
[J]. F&M-FEINWERKTECHNIK & MESSTECHNIK, 1989, 97 (11): : 479 - 483
[7] Adhesives for assembly on printed-circuit boards
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Parfenov, A. N.
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[J]. POLYMER SCIENCE SERIES C, 2007, 49 (01) : 52 - 55
[8] INFRARED INSPECTION OF PRINTED-CIRCUIT BOARDS
WENDELER, V
[J]. F&M-FEINWERKTECHNIK & MESSTECHNIK, 1988, 96 (06): : 263 - 264
[9] SOLDERING OF SMDS ON PRINTED-CIRCUIT BOARDS
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[J]. F&M-FEINWERKTECHNIK & MESSTECHNIK, 1987, 95 (05): : 315 - 317
[10] CROSSTALK IN MULTILAYER PRINTED-CIRCUIT BOARDS
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DAY, RL
NGUYEN, T
[J]. IEEE TRANSACTIONS ON EDUCATION, 1988, 31 (02) : 116 - 119