Adhesives for assembly on printed-circuit boards

被引：1
|
作者：
Lukin, A. A.
Parfenov, A. N.
Anikhovskaya, L. I.
Skachkova, V. K.
机构：
[1] AOZT MMP, IRBIS, Moscow 107005, Russia
[2] NPF Tekhpolikom, Moscow 107005, Russia
[3] Russian Acad Sci, Semenov Inst Chem Phys, Moscow 119991, Russia
来源：
POLYMER SCIENCE SERIES C | 2007年 / 49卷 / 01期
关键词：
Polymer Science Series; Print Circuit Board; Trade Mark; Adhesive Composition; Thermosetting Epoxy;
D O I：
10.1134/S1811238207010122
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
Requirements for adhesives used in the surface-mount technique are presented. Properties of a heat-setting epoxy adhesive TPK-4 designed at the Semenov Institute of Chemical Physics of the Russian Academy of Sciences together with the OOO NPF Tekhpolikom are described.
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页码：52 / 55
页数：4
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