STRUCTURAL CHARACTERIZATION OF CO IN SPUTTERED TA/CO/TA THIN-FILM SANDWICHES

被引:7
|
作者
BENAISSA, M
HUMBERT, P
LEFAKIS, H
WERCKMANN, J
SPERIOSU, VS
GURNEY, BA
机构
[1] IPCMS, CNRS, UMR 46, SURFACES INTERFACES GRP, F-67037 STRASBOURG, FRANCE
[2] IBM CORP, ALMADEN RES CTR, DIV RES, SAN JOSE, CA 95120 USA
关键词
D O I
10.1016/0304-8853(95)00129-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The morphology and structure of sputtered Ta/Co/Ta thin-film sandwiches were investigated by cross-sectional high-resolution transmission electron microscopy. Although the Co layer shows an overall [111]-oriented fee structure, a high density of hcp stacking faults is present in the layer. The Co structure can thus be described as a random distribution of hcp stacking sequences in an overall fee structure.
引用
收藏
页码:15 / 16
页数:2
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