CERAMIC FILTERS AUGMENT COMPANY LINE OF PACKAGES

被引：0
|
作者：
不详
机构：
来源：
MICROWAVES & RF | 1995年 / 34卷 / 10期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
PACKAGES have been the forte of a firm known for processing high-performance ceramic materials. But Strat-Edge Corp. (San Diego, CA) has also been busy the last several years fabricating filters on ceramic substrates. The company has supplied filters to several military and satellite-communications systems, including the Inmarsat 3 satellite program-the first time the firm has qualified for full space use of a product.
引用
收藏
页码：136 / 136
页数：1
相关论文
共 50 条
  • [41] Controlling Emissions With Ceramic Filters
    Startin, Andrew
    Elliott, Gary
    CHEMICAL ENGINEERING, 2009, 116 (01) : 35 - 39
  • [42] RI-MINACE filters to augment segmentation of touching objects
    Casasent, D
    Cox, W
    OPTICAL PATTERN RECOGNITION VIII, 1997, 3073 : 354 - 363
  • [43] RI-MINACE filters to augment segmentation of touching objects
    Casasent, D
    Cox, W
    PATTERN RECOGNITION, 1998, 31 (09) : 1311 - 1317
  • [44] AMERICAN-CERAMIC-COMPANY-BULLETIN - 8TH ANNUAL CERAMIC COMPANY DIRECTORY - 1971
    不详
    AMERICAN CERAMIC SOCIETY BULLETIN, 1971, 50 (01): : 23 - &
  • [45] AMERICAN CERAMIC SOCIETY BULLETIN - CERAMIC COMPANY DIRECTORY ISSUE
    不详
    AMERICAN CERAMIC SOCIETY BULLETIN, 1974, 53 (01): : 1 - 150
  • [46] High-volume production of ceramic BGA packages
    Electronic Packaging and Production, 1997, 37 (12):
  • [47] Direct-write precision resistors for ceramic packages
    Yang, P.
    Dimos, D.
    Rodriguez, M.A.
    Huang, R.F.
    Dai, S.
    Wilcox, D.
    Materials Research Society Symposium - Proceedings, 1999, 542 : 159 - 164
  • [48] Full-wave characterisation of RF ceramic packages
    Schuh, P
    Bilzer, H
    Menzel, W
    Kiwitt, J
    Pitschi, M
    33RD EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGS, 2003, : 635 - 638
  • [49] A novel high performance die attach for ceramic packages
    Shi, JZ
    Xie, XM
    Stubhan, F
    Freytag, J
    JOURNAL OF ELECTRONIC PACKAGING, 2000, 122 (02) : 168 - 171
  • [50] MECHANICAL AND ENVIRONMENTAL TESTS OF BRAZED CERAMIC MULTILAYER PACKAGES
    WEIRAUCH, DA
    WELDING JOURNAL, 1994, 73 (05) : S110 - S118
12345