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- [25] DIE ATTACHMENT OF VLSI DEVICES IN CERAMIC PACKAGES SAMPE QUARTERLY-SOCIETY FOR THE ADVANCEMENT OF MATERIAL AND PROCESS ENGINEERING, 1989, 21 (01): : 12 - 21
- [28] Ceramic Packages for Acoustically Coupled Neural Implants 2019 9TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING (NER), 2019, : 847 - 850
- [29] The manufacturing logistics of cofire ceramic electronic packages NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, : 322 - 328