High resolution thermoplastic rapid manufacturing using injection moulding with SU-8 based silicon tools

被引:5
|
作者
Malek, C. Khan [1 ]
Robert, L. [1 ]
Michel, G. [1 ]
Singh, A. [1 ]
Sahli, M. [1 ]
Manuel, B. Gauthier [1 ]
机构
[1] Inst FEMTOST, CNRS, UMR 6174, F-25044 Besancon, France
关键词
Injection moulding; Polymer; Fast tooling; Photolithography; Electron beam lithography; Epoxy; SU-8;
D O I
10.1016/j.cirpj.2011.04.001
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The present work focuses on developing cost-efficient, fast and precise tooling for prototyping and smallseries manufacture of polymer chips using injection moulding. Exchangeable mould inserts were manufactured on thick silicon wafers patterned using SU-8 negative epoxy-based resist. First masters with feature size from a few tens to hundreds of micrometers were produced in SU-8 photoresist by contact photolithography. Polypropylene (PP), cyclo-olefin-co-polymer (COC) and polymethylmethacrylate (PMMA) were used as the injection moulding materials. A study of the PP parts was carried out using scanning mechanical microscopy (SMM) and scanning electron microscopy (SEM). In addition, submicronic features (500 nm) were replicated in PP from a tool patterned by e-beam lithography. (C) 2011 CIRP.
引用
收藏
页码:382 / 390
页数:9
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