High resolution thermoplastic rapid manufacturing using injection moulding with SU-8 based silicon tools

被引：5

作者：

Malek, C. Khan ^{[1
]}

Robert, L. ^{[1
]}

Michel, G. ^{[1
]}

Singh, A. ^{[1
]}

Sahli, M. ^{[1
]}

Manuel, B. Gauthier ^{[1
]}

机构：

[1] Inst FEMTOST, CNRS, UMR 6174, F-25044 Besancon, France

来源：

CIRP JOURNAL OF MANUFACTURING SCIENCE AND TECHNOLOGY | 2011年 / 4卷 / 04期

关键词：

Injection moulding; Polymer; Fast tooling; Photolithography; Electron beam lithography; Epoxy; SU-8;

D O I：

10.1016/j.cirpj.2011.04.001

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The present work focuses on developing cost-efficient, fast and precise tooling for prototyping and smallseries manufacture of polymer chips using injection moulding. Exchangeable mould inserts were manufactured on thick silicon wafers patterned using SU-8 negative epoxy-based resist. First masters with feature size from a few tens to hundreds of micrometers were produced in SU-8 photoresist by contact photolithography. Polypropylene (PP), cyclo-olefin-co-polymer (COC) and polymethylmethacrylate (PMMA) were used as the injection moulding materials. A study of the PP parts was carried out using scanning mechanical microscopy (SMM) and scanning electron microscopy (SEM). In addition, submicronic features (500 nm) were replicated in PP from a tool patterned by e-beam lithography. (C) 2011 CIRP.

引用

页码：382 / 390

页数：9

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