SILICON DIOXIDE PROFILE CONTROL FOR CONTACTS AND VIAS

被引:0
|
作者
GIFFEN, L
WU, J
LACHENBRUCH, R
FIOR, G
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:55 / 57
页数:3
相关论文
共 50 条
  • [21] Future Directions for Through Silicon Vias
    Fischer, P. B.
    Morrow, P. R.
    Baskaran, R.
    O'Brien, K. P.
    ELECTRONICS AND 3-D PACKAGING 4, 2011, 33 (36): : 1 - 9
  • [22] CONTROL OF SILICON DIOXIDE PROPERTIES BY RF SPUTTERING
    LEE, MK
    CHANG, CY
    TZENG, JS
    SU, YK
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (03) : 658 - 659
  • [23] END-POINT DETECTION FOR CONTACTS AND VIAS IN VLSI TECHNOLOGY
    MITTAL, S
    MOGHADAM, F
    RANADIVE, D
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (08) : C311 - C311
  • [24] HIGH FREQUENCY CHARACTERIZATION OF SILICON SUBSTRATE AND THROUGH SILICON VIAS
    Duan, Xiaomin
    Boettcher, Mathias
    Dahl, David
    Schuster, Christian
    Tschoban, Christian
    Ndip, Ivan
    Lang, Klaus-Dieter
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 1544 - 1550
  • [25] Power Noise Isolation in a Silicon Interposer with Through Silicon Vias
    Kim, Myunghoi
    Shin, Dong-Hwan
    Um, Man-Seok
    Yom, In-Bok
    2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2014, : 805 - 808
  • [26] Improving the stability of thin polycrystalline silicon passivated contacts using titanium dioxide interlayers
    Yan, Di
    Michel, Jesus Ibarra
    Phang, Sieu Pheng
    Basnet, Rabin
    Pan, Yida
    Johnson, Brett C.
    Sun, Jimmy
    Li, Yumin
    Shen, Heping
    Yang, Jie
    Zhang, Xinyu
    Macdonald, Daniel
    Zheng, Peiting
    Bullock, James
    SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2025, 285
  • [27] Fabrication and formation of Ta/Pt-Si ohmic contacts applied to high-temperature Through Silicon Vias (TSVs)
    Gueye, R.
    Akiyama, T.
    Briand, D.
    de Rooij, N. F.
    SENSORS AND ACTUATORS A-PHYSICAL, 2013, 191 : 45 - 50
  • [28] Tutorial on forming through-silicon vias
    Burkett, Susan L.
    Jordan, Matthew B.
    Schmitt, Rebecca P.
    Menk, Lyle A.
    Hollowell, Andrew E.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2020, 38 (03):
  • [29] Process integration for through-silicon vias
    Spiesshoefer, S
    Rahman, Z
    Vangara, G
    Polamreddy, S
    Burkett, S
    Schaper, L
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2005, 23 (04): : 824 - 829
  • [30] Effect of Microstructure on Via Extrusion Profile and Reliability Implication for Copper Through-Silicon Vias (TSVs) Structures
    Jiang, Tengfei
    Wu, Chenglin
    Im, Jay
    Huang, Rui
    Ho, Paul S.
    2014 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC), 2014, : 377 - 379