FORMATION OF DEEP COMPLEXES IN ZNSE DURING OHMIC CONTACT ANNEALING

被引:7
|
作者
HEUKEN, M
SOLLNER, J
GUIMARAES, FEG
MARQUARDT, K
HEIME, K
机构
[1] Institut für Halbleitertechnik, RWTH Aachen, Germany, W-5100 Aachen
关键词
D O I
10.1063/1.107214
中图分类号
O59 [应用物理学];
学科分类号
摘要
The formation of ohmic contacts to n-ZnSe grown by metalorganic vapor-phase epitaxy (MOVPE) on GaAs was investigated by current-voltage and photoluminescence (PL) measurements. Annealing of the contacts even at temperatures as low as 300-degrees-C causes the formation of deep complexes with PL emissions at 2.25 - 2.35 and 1.97 eV. These centers degrade the electrical and optical properties of the ZnSe epitaxial layers. The effects of strain and Ga outdiffusion on ohmic contact properties was investigated in ZnSe layers of various thicknesses. Due to a gallium-doped ZnSe transition layer at the substrate heterointerface ohmic contacts are easily formed only on thin layers.
引用
收藏
页码:1694 / 1696
页数:3
相关论文
共 50 条
  • [41] MECHANISM OF OHMIC CONTACT FORMATION BY EBIC, SAM, AND SIMS
    HILL, IR
    YANG, R
    LAU, WM
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (04) : C230 - C230
  • [42] Ti/Ni Ohmic Contact Formation to InAs Nanowire
    Jo, Min Hyeok
    Shin, Jae Cheol
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2017, 17 (05) : 3333 - 3336
  • [43] Ohmic contact formation on n-type Ge
    Lieten, R. R.
    Degroote, S.
    Kuijk, M.
    Borghs, G.
    APPLIED PHYSICS LETTERS, 2008, 92 (02)
  • [44] Ohmic contact formation of Ti/Al/Ni/Au to n-GaN by two-step annealing method
    Chen, ZZ
    Qin, ZX
    Hu, CY
    Hu, XD
    Yu, TJ
    Tong, YZ
    Ding, XM
    Zhang, GY
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2004, 111 (01): : 36 - 39
  • [45] Effects of annealing and different substrate materials on ohmic contact property of IGZO films
    Shi Jifeng
    APPLIED MATERIALS AND TECHNOLOGIES FOR MODERN MANUFACTURING, PTS 1-4, 2013, 423-426 : 846 - 851
  • [46] Annealing atmosphere influence on contact resistivity of ohmic Pd/Ge/Au contact to n-GaAs
    Mitin, D. M.
    Soldatenkov, F. Yu.
    Mozharov, A. M.
    Vasil'ev, A. A.
    Neplokh, V. V.
    Mukhin, I. S.
    NANOSYSTEMS-PHYSICS CHEMISTRY MATHEMATICS, 2018, 9 (06): : 789 - 792
  • [47] Effect of surface cleaning by wet treatments and ultra high vacuum annealing for ohmic contact formation of P-type GaN
    Department of Applied Chemistry, University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
    不详
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2000, 39 (7 B): : 4451 - 4455
  • [48] The effect of surface cleaning by wet treatments and ultra high vacuum annealing for ohmic contact formation of P-type GaN
    Waki, I
    Fujioka, H
    Ono, K
    Oshima, M
    Miki, H
    Fukizawa, A
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2000, 39 (7B): : 4451 - 4455
  • [49] A versatile low-resistance ohmic contact process with ohmic recess and low-temperature annealing for GaN HEMTs
    Lin, Yen-Ku
    Bergsten, Johan
    Leong, Hector
    Malmros, Anna
    Chen, Jr-Tai
    Chen, Ding-Yuan
    Kordina, Olof
    Zirath, Herbert
    Chang, Edward Yi
    Rorsman, Niklas
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2018, 33 (09)
  • [50] OHMIC CONTACT FORMATION ON INP BY PULSED LASER PHOTOCHEMICAL DOPING
    DEUTSCH, TF
    EHRLICH, DJ
    OSGOOD, RM
    LIAU, ZL
    APPLIED PHYSICS LETTERS, 1980, 36 (10) : 847 - 849