RADIO-FREQUENCY REACTIVE SPUTTER ETCHING CONTROL OF ETCH RATES

被引：5
|
作者：
HORWITZ, CM [1 ]
机构：
[1] MIT,ELECTR RES LAB,CAMBRIDGE,MA 02139
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1983年 / 1卷 / 03期
关键词：
D O I：
10.1116/1.582659
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：840 / 843
页数：4
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