DEVELOPMENT OF THE REGIMES OF SEMIAUTOMATIC CONTACT SOLDERING

被引：0
|
作者：
Shtennikov, V. N. [1 ]
机构：
[1] Ural Fed Univ, Inst Radioelect & Informat Technol, 19 Mir Str, Ekaterinburg 620002, Russia
来源：
JOURNAL OF ENGINEERING PHYSICS AND THERMOPHYSICS | 2015年 / 88卷 / 01期
关键词：
contact soldering; multilayer printed circuit board; temperature; heat exchange; solder;
D O I：
10.1007/s10891-015-1190-x
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
The influence of the soldering rod length on the contact soldering temperature has been studied. The results of investigations were taken as a basis for incorporating a high-speed semiautomatic regime of soldering integrated circuits with planar leads to multilayer printed circuit boards. It has been established that to ensure an optimum soldering temperature it is necessary to take account of the temperature of the soldering rod before soldering, its length and diameter, and the soldering time when the rod is short.
引用
收藏
页码：282 / 284
页数：3
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