LOW-COST PIN GRID ARRAY PACKAGES

被引：0

作者：

BROWN, CH

机构：

来源：

SOLID STATE TECHNOLOGY | 1985年 / 28卷 / 05期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：239 / 241

页数：3

共 50 条

[1] A UNIQUE LOW-COST PIN GRID ARRAY PACKAGE WITH HEATSPREADER
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[J]. PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2, 1989, : 199 - 207
[2] ATTRACTIVE PACKAGES ... AT LOW-COST
不详
[J]. FOOD ENGINEERING, 1982, 54 (10): : 53 - 53
[3] THE MIGRATION FAILURE MECHANISM ON PIN GRID ARRAY VLSI PACKAGES
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[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (08) : C318 - C318
[4] Validation of numerical models of ceramic pin grid array packages
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[5] FIGURES OF MERIT FOR SMT AND PIN-GRID-ARRAY ASIC PACKAGES
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[7] 3 LOW-COST MAPPING PACKAGES FOR MICROCOMPUTERS
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[J]. JOURNAL OF THE AMERICAN PLANNING ASSOCIATION, 1986, 52 (04) : 480 - 488
[8] Power fidelity performance & thermal management of wirebond pin grid array packages
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[J]. 1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1996, 2920 : 365 - 370
[9] INDUCTANCE CALCULATION AND OPTIMAL PIN ASSIGNMENT FOR THE DESIGN OF PIN-GRID-ARRAY AND CHIP CARRIER PACKAGES
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[10] A low-cost, flexible ball-grid-array multichip module technology
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