DESIGNERS STRIVE FOR LOW-COST MMIC PACKAGES

Despite the steady pace in MMIC device development impelled by the DARPA-sponsored MIMIC program, the technology for packaging such devices has lagged woefully behind. This shortcoming forces performance compromises, such as GaAs devices designed to function at frequencies higher than 40 GHz to be limited to operation below 30 GHz. Similarly, although automated production techniques have been developed to turn out intricate microwave ICs by the thousands per month at reasonable cost, the housings for the final assembly of these devices are costly and time-consuming to produce.