共 50 条
- [38] Synchrotron Measurement of the Effect of Dielectric Porosity and Air Gaps on the Stress in Advanced Cu/Low-k Interconnects PROCEEDINGS OF THE 2009 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2009, : 72 - +
- [39] Effect of microstructure and dielectric materials on stress-induced damages in damascene Cu/low-k interconnects THIN FILMS STRESSES AND MECHANICAL PROPERTIES XI, 2005, 875 : 301 - 312
- [40] Mechanisms of Electromigration under AC and Pulsed-DC Stress in Cu/Low-k Dual Damascene Interconnects 2015 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2015,