IMPROVED PERFORMANCE OF IBM ENTERPRISE SYSTEM 9000 BIPOLAR LOGIC CHIPS

被引:6
|
作者
BARISH, AE
ECKHARDT, JP
MAYO, MD
SVARCZKOPF, WA
GAUR, SP
机构
关键词
D O I
10.1147/rd.365.0829
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The performance required for logic gate arrays by the IBM Enterprise System/9000TM (ES/9000TM) family of water-cooled processors was obtained by redesigning chips that previously consisted of emitter-coupled logic (ECL) circuits. Multiple bipolar logic circuit families were implemented for the first time on a single IBM chip by using a modular cell approach. In 60% of the ECL circuits, ac coupling in ECL gates reduced the maximum operating power per ECL circuit on ES/9000 chips by 50% and decreased the signal delay per loaded gate by 30%, to 150 ps. About 10-20% of the remaining ECL circuits were replaced by differential current switches (DCS) which dissipated less power and improved the overall chip performance. Circuits to communicate between ECL and DCS circuit families and to improve DCS circuit reliability were included on the ES/9000 chips without affecting logic function density.
引用
下载
收藏
页码:829 / 834
页数:6
相关论文
共 50 条
  • [31] EXPANDED IBM-9000 SYSTEM TARGETS MULTIUSER BUSINESS APPLICATIONS
    VALIGRA, L
    MINI-MICRO SYSTEMS, 1984, 17 (06): : 48 - &
  • [32] Performance of the improved JBX-9000MV e-beam lithography system
    Komagata, T
    Nakagawa, Y
    Gotoh, N
    Tanaka, K
    EMERGING LITHOGRAPHIC TECHNOLOGIES V, 2001, 4343 : 736 - 745
  • [33] Performance of improved e-beam lithography system JBX-9000MVII
    Komagata, T
    Nakagawa, Y
    Gotoh, N
    Tanaka, K
    PHOTOMASK AND NEXT-GENERATION LITHOGRAPHY MASK TECHNOLOGY VIII, 2001, 4409 : 248 - 257
  • [34] Structural and functional test of IBM System z10 chips
    Salem, G.
    Wittig, D. W.
    Foote, T. G.
    Robbins, B. J.
    Hirko, C.
    Forlenza, D. O.
    Motika, F.
    Kyle, J. A.
    Kusko, M. P.
    Forlenza, O. P.
    Frishmuth, R. J.
    Yaari, R.
    Michnowski, S.
    Baur, U.
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2009, 53 (01)
  • [35] IBM MULTICHIP MULTILAYER CERAMIC MODULES FOR LSI CHIPS - DESIGN FOR PERFORMANCE AND DENSITY
    CLARK, BT
    HILL, YM
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (01): : 89 - 93
  • [36] A COMPREHENSIVE CAD SYSTEM FOR HIGH-PERFORMANCE 300K-CIRCUIT ASIC LOGIC CHIPS
    PANNER, JH
    ABATO, RP
    BASSETT, RW
    CARRIG, KM
    GILLIS, PS
    HATHAWAY, DJ
    SEHR, TW
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1991, 26 (03) : 300 - 309
  • [37] Design and verification of the IBM System z10 I/O subsystem chips
    Schlipf, T.
    Helms, M. M.
    Ruf, J.
    Klein, M.
    Dorsch, R.
    Hoppe, B.
    Lipponer, W.
    Boekholt, S.
    Roewer, T.
    Walz, M.
    Junghans, S.
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2009, 53 (01) : 1 - 13
  • [38] Bipolar differential cell with improved bandwidth performance
    Balsi, M
    Centurelli, F
    Pennisi, S
    Trifiletti, A
    ICES 2002: 9TH IEEE INTERNATIONAL CONFERENCE ON ELECTRONICS, CIRCUITS AND SYSTEMS, VOLS I-111, CONFERENCE PROCEEDINGS, 2002, : 1055 - 1058
  • [39] IBM 3090 PERFORMANCE - A BALANCED SYSTEM APPROACH
    SINGH, Y
    KING, GM
    ANDERSON, JW
    IBM SYSTEMS JOURNAL, 1986, 25 (01) : 20 - 35
  • [40] IBM RISC SYSTEM 6000 - ARCHITECTURE AND PERFORMANCE
    OEHLER, RR
    BLASGEN, MW
    IEEE MICRO, 1991, 11 (03) : 14 - &