IBM MULTICHIP MULTILAYER CERAMIC MODULES FOR LSI CHIPS - DESIGN FOR PERFORMANCE AND DENSITY

被引：27
|
作者：
CLARK, BT [1 ]
HILL, YM [1 ]
机构：
[1] IBM CORP,FISHKILL,NY
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1980年 / 3卷 / 01期
关键词：
D O I：
10.1109/TCHMT.1980.1135570
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：89 / 93
页数：5
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