ECONOMICAL HIGH-DENSITY MULTILAYER INTERCONNECT SYSTEM DEVELOPED FOR MULTICHIP MODULES, LARGE MOTHERBOARDS

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作者：
FLETCHER, P
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ELECTRONIC DESIGN | 1995年 / 43卷 / 12期
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TM [电工技术]; TN [电子技术、通信技术];
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0808 ; 0809 ;
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页码：42 / 46
页数：5
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