FABRICATION OF HIGH-DENSITY MULTICHIP MODULES

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作者：
RECHE, JJH
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来源：
SEVENTH IEEE/CHMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM: INTEGRATION OF THE MANUFACTURING FLOW - FROM RAW MATERIAL THROUGH SYSTEMS-LEVEL ASSEMBLY | 1989年
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：104 / 109
页数：6
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