CONTROL OF THIN-FILM MATERIALS PROPERTIES USED IN HIGH-DENSITY MULTICHIP INTERCONNECT

被引：1
|
作者：
RECHE, JJH
机构：
来源：
ELECTRONIC PACKAGING MATERIALS SCIENCE IV | 1989年 / 154卷
关键词：
D O I：
10.1557/PROC-154-39
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
引用
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页码：39 / 46
页数：8
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