Reliability testing of SnAgCu solder surface mount assembly

被引：0

作者：

Stam, FA ^{[1
]}

Davitt, E ^{[1
]}

Barrett, J ^{[1
]}

机构：

[1] Natl Univ Ireland Univ Coll Cork, Natl Microelect Res Ctr, Cork, Ireland

来源：

1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS | 1999年 / 3906卷

关键词：

lead-free reflow soldering; reliability; power cycling; thermal shock; vibration testing;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Accelerated reliability tests have been performed on a number of lead-free SMT soldering assembly configurations and have shown that lead-free reflow soldering is a viable option compared to conventional lead based reflow soldering. For the selected ternary eutectic solder alloy SnAg3.5Cu0.7 higher processing temperatures might require some component re-specifications, but other than that no major modifications seem necessary. In general, quite similar reliability results were obtained as found for the near eutectic lead based solders. Dependent on board and component metallisations and use environment the reliability of the lead-free solders could perform better or worse than the lead based solders. Temperature dependent aspects such as solderability and mechanical behaviour of the lead-free assemblies could play a role in this.

引用

页码：259 / 263

页数：5

共 50 条

[21] SURFACE MOUNT ASSEMBLY PROBLEMS: ELIMINATION OF PC SOLDER RESIST.
Hamilton, P.G.B.
Circuit World, 1987, 13 (03) : 72 - 73
[22] SOLDER JOINT RELIABILITY OF FINE PITCH SURFACE MOUNT TECHNOLOGY ASSEMBLIES
LAU, J
POWERSMALONEY, LM
BAKER, JR
RICE, D
SHAW, B
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (03): : 534 - 544
[23] Reliability of SnAgCu Solder Joints During Vibration in Various Temperature
Matkowski, Przemyslaw
2011 34TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2011) - NEW TRENDS IN MICRO/NANOTECHNOLOGY, 2011, : 341 - 347
[24] Solder Joint Reliability of SnAgCu Solder Refinished Components Under Temperature Cycling Test
Wang, Weiqiang
Osterman, Michael
Das, Diganta
Pecht, Michael
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (05): : 798 - 808
[25] The interplay of surface mount solder joint quality and reliability of low volume SMAs
Ghaffarian, R
DESIGN & RELIABILITY OF SOLDERS AND SOLDER INTERCONNECTIONS, 1997, : 317 - 328
[26] The effect of solder paste volume on surface mount assembly self- alignment
Pan, K.
Ha, J. H.
Wang, H. Y.
Veeraraghavan, V.
Park, S. B.
29TH INTERNATIONAL CONFERENCE ON FLEXIBLE AUTOMATION AND INTELLIGENT MANUFACTURING (FAIM 2019): BEYOND INDUSTRY 4.0: INDUSTRIAL ADVANCES, ENGINEERING EDUCATION AND INTELLIGENT MANUFACTURING, 2019, 38 : 1381 - 1393
[27] STENCIL PRINTING OF SOLDER PASTE FOR FINE-PITCH SURFACE MOUNT ASSEMBLY
MORRIS, JR
WOJCIK, T
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (03): : 560 - 566
[28] Effect of Cu Content on the Interfacial Reliability of SnAgCu Solder Joints
Zeng, Kejun
Holdford, Becky
2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 652 - 659
[29] Solder joint fatigue in a surface-mount assembly subjected to mechanical loading
Tamin, MN
Liew, YB
Wagiman, ANR
Loh, WX
PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 439 - 443
[30] Impact of Surface Finish, Solder Volume and Solder Composition on the Grain Structure of SnAgCu Solder Joints
Tegehall, Per-Erik
2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2020,

← 1 2 3 4 5 →