Reliability of SnAgCu Solder Joints During Vibration in Various Temperature

被引：0
|
作者：
Matkowski, Przemyslaw [1 ]
机构：
[1] Wroclaw Univ Technol, Fac Microsyst Elect & Photon, PL-50370 Wroclaw, Poland
来源：
2011 34TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2011) - NEW TRENDS IN MICRO/NANOTECHNOLOGY | 2011年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The results of study focused on reliability of SnAgCu/ImSn (1206 and 0805 SMD) solder joints subjected to vibration in various but constant temperature (-40 and + 130) will be presented. The results will be also compared with the results of author's previous reliability tests focused on reliability of SnAgCu solder joints subjected to vibration combined with temperature cycles. Time to failure will be measured using dedicated event detector. After the tests solder joints will be inspected using ultra high-resolution nanofocus (R) X-ray inspection system and nanoCT (R).
引用
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页码：341 / 347
页数：7
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