Reliability of SnAgCu Solder Joints During Vibration in Various Temperature

被引：0
|
作者：
Matkowski, Przemyslaw [1 ]
机构：
[1] Wroclaw Univ Technol, Fac Microsyst Elect & Photon, PL-50370 Wroclaw, Poland
来源：
2011 34TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2011) - NEW TRENDS IN MICRO/NANOTECHNOLOGY | 2011年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The results of study focused on reliability of SnAgCu/ImSn (1206 and 0805 SMD) solder joints subjected to vibration in various but constant temperature (-40 and + 130) will be presented. The results will be also compared with the results of author's previous reliability tests focused on reliability of SnAgCu solder joints subjected to vibration combined with temperature cycles. Time to failure will be measured using dedicated event detector. After the tests solder joints will be inspected using ultra high-resolution nanofocus (R) X-ray inspection system and nanoCT (R).
引用
收藏
页码：341 / 347
页数：7
相关论文
共 50 条
  • [11] Reliability of SnAgCu/SnAgCuCe solder joints with different heights for electronic packaging
    Liang Zhang
    Ji-guang Han
    Yong-huan Guo
    Lei Sun
    Journal of Materials Science: Materials in Electronics, 2014, 25 : 4489 - 4494
  • [12] Reliability analysis of thermal shock for SnAgCu solder joints of FCBGA devices
    Jiang N.
    Zhang L.
    Liu Z.
    Xiong M.
    Long W.
    Hanjie Xuebao/Transactions of the China Welding Institution, 2019, 40 (09): : 39 - 42
  • [13] Recrystallization behaviour of SnAgCu solder joints
    Sundelin, Janne J.
    Nurmi, Sami T.
    Lepisto, Tbivo K.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 474 (1-2): : 201 - 207
  • [14] Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe—Ni Solder Joints
    Hao Zhang
    Qing-Sheng Zhu
    Zhi-Quan Liu
    Li Zhang
    Hongyan Guo
    Chi-Ming Lai
    Journal of Materials Science & Technology, 2014, 30 (09) : 928 - 933
  • [15] The Interfacial Reactions and Reliability of SnAgCu Solder Joints under Thermal Shock Cycles
    Oh, Chulmin
    Park, Nochang
    Han, Changwoon
    Bang, Mansoo
    Hong, Wonsik
    JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, 2009, 47 (08): : 500 - 507
  • [16] The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints
    Liu, Weiping
    Lee, Ning-Cheng
    JOM, 2007, 59 (07) : 26 - 31
  • [17] The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints
    Weiping Liu
    Ning-Cheng Lee
    JOM, 2007, 59 : 26 - 31
  • [18] Thermal cycling aging effect on the reliability and morphological evolution of SnAgCu solder joints
    Teo, J. W. Ronnie
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2007, 30 (04): : 279 - 284
  • [19] Anand constitutive relation of SnAgCu-nano Al and the reliability of solder joints
    Zhang, Liang
    Han, Ji-Guang
    Guo, Yong-Huan
    He, Cheng-Wen
    Dianzi Keji Daxue Xuebao/Journal of the University of Electronic Science and Technology of China, 2015, 44 (03): : 471 - 474
  • [20] Electromigration Failure with Thermal Gradient Effect in SnAgCu Solder Joints with Various UBM
    Xu, Luhua
    Liang, S. W.
    Xu, Di
    Han, Jung-Kyu
    Liang, Jarrett
    Tu, K. N.
    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 909 - +
12345