STUDIES OF PLASMA-ETCHING MECHANISMS WITH CANTILEVER STRUCTURES

被引:0
|
作者
REYNOLDS, JL [1 ]
NOLLINS, J [1 ]
NEUREUTHER, AR [1 ]
机构
[1] UNIV CALIF BERKELEY,DEPT ELECT ENGN & COMP SCI,ELECTR RES LAB,BERKELEY,CA 94720
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:C84 / C84
页数:1
相关论文
共 50 条
  • [1] BASIC MECHANISMS IN PLASMA-ETCHING
    DEUTSCH, H
    KERSTEN, H
    RUTSCHER, A
    [J]. CONTRIBUTIONS TO PLASMA PHYSICS, 1989, 29 (03) : 263 - 284
  • [2] PLASMA-ETCHING - A DISCUSSION OF MECHANISMS
    COBURN, JW
    WINTERS, HF
    [J]. CRC CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 1981, 10 (02): : 119 - 141
  • [3] PLASMA-ETCHING - DISCUSSION OF MECHANISMS
    COBURN, JW
    WINTERS, HF
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1979, 16 (02): : 391 - 403
  • [4] BASIC CHEMISTRY AND MECHANISMS OF PLASMA-ETCHING
    FLAMM, DL
    DONNELLY, VM
    IBBOTSON, DE
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1983, 1 (01): : 23 - 30
  • [5] MECHANISTIC STUDIES OF OXYGEN PLASMA-ETCHING
    HARTNEY, MA
    GREENE, WM
    SOANE, DS
    HESS, DW
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1988, 6 (06): : 1892 - 1895
  • [6] PLASMA-ETCHING OF SILYLATED PHOTORESIST - A STUDY OF MECHANISMS
    JOUBERT, O
    PONS, M
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1993, 11 (01): : 26 - 31
  • [7] PLASMA-ETCHING OF MATERIALS FOR SEMICONDUCTOR STRUCTURES AND DEVICES
    GULDAN, A
    LUBY, S
    HRKUT, P
    KUBEK, J
    [J]. CESKOSLOVENSKY CASOPIS PRO FYSIKU SEKCE A, 1979, 29 (05): : 468 - +
  • [8] APPLICATION OF PLASMA-ETCHING TO MULTILEVEL METAL STRUCTURES
    KITCHER, JR
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (08) : C375 - C375
  • [9] PLASMA-ETCHING
    MUCHA, JA
    HESS, DW
    [J]. ACS SYMPOSIUM SERIES, 1983, 219 : 215 - 285
  • [10] ANISOTROPIC ETCHING OF SUBMICRONIC RESIST STRUCTURES BY RESONANT INDUCTIVE PLASMA-ETCHING
    ETRILLARD, J
    FRANCOU, JM
    INARD, A
    HENRY, D
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1994, 33 (10): : 6005 - 6012