共 50 条
- [21] EFFECT OF DIE-ATTACH TEMPERATURE (455-DEGREES-C) ON THE BONDABILITY OF BOND FINGER OF GOLD PACKAGESJOURNAL OF ELECTRONIC MATERIALS, 1987, 16 (05) : 341 - 345LEE, KCLIM, LKHU, SJ
- [22] Automatic Inspection of Epoxy Die-attach Process of a Semiconductor ChipMATERIALE PLASTICE, 2014, 51 (04) : 448 - 451Amza, Catalin Gheorghe
- [23] Low Temperature Consolidation of Micro/Nanosilver Die-Attach PreformsJOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (09) : 3379 - 3388McCoppin, JaredReitz, Thomas L.Miller, RyanVijwani, HemaMukhopadhyay, SharmilaYoung, Daniel
- [24] Effect of die-attach adhesives on the stress evolution in MEMS packaging2003 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2003, 5288 : 847 - 852Walwadkar, SSFarrell, PWFelton, LECho, J
- [25] Fine Die-Attach Delamination Analysis by Scanning Acoustic Microscope2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, : 187 - 190Santospirito, G.Terzoli, A.
- [26] Low Temperature Consolidation of Micro/Nanosilver Die-Attach PreformsJournal of Electronic Materials, 2014, 43 : 3379 - 3388Jared McCoppinThomas L. ReitzRyan MillerHema VijwaniSharmila MukhopadhyayDaniel Young
- [27] On The Effect of Ramp Rate in Damage Accumulation of The CPV Die-Attach2012 38TH IEEE PHOTOVOLTAIC SPECIALISTS CONFERENCE (PVSC), 2012, : 1820 - 1825Bosco, Nick S.Silverman, Timothy J.Kurtz, Sarah R.
- [28] Die-attach on Copper by Pressureless Silver Sintering in Formic Acid2019 31ST INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2019, : 499 - 502Wang, MeiyuXie, YijingMei, YunhuiLi, XinLu, Guo-Quan
- [29] In situ evaluation of residual stresses in an organic die-attach adhesiveJOURNAL OF ELECTRONIC PACKAGING, 1998, 120 (03) : 314 - 318Voloshin, ASTsao, PHPearson, RA
- [30] Estimation of thermal resistance distributions for die-attach testing in microelectronicsINVERSE PROBLEMS IN SCIENCE AND ENGINEERING, 2007, 15 (07) : 715 - 742Feuillet, V.Jarny, Y.Scudeller, Y.