RELIABILITY COMPARISON OF 2 METALLURGIES FOR CERAMIC BALL GRID ARRAY

被引：12
|
作者：
BANKS, DR
BURNETTE, TE
GERKE, RD
MAMMO, E
MATTAY, S
机构：
[1] Motorola, Inc., Advanced Packaging Technology, Austin, Texas
来源：
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1995年 / 18卷 / 01期
关键词：
D O I：
10.1109/96.365483
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Surface-mountable ceramic ball grid array (CBGA) packages have proven to be attractive in a variety of applications as designers seek to maximize electrical performance, reduce card real estate, and improve manufacturing process yields. In support of the PowerPC(TM) family of microprocessors, 21 mm CBGA packages (256 leads) were used to evaluate two different ball metallurgies-90/10 Pb/Sn and 62/36/2 Sn/Pb/Ag. Test modules were assembled to printed circuit cards and cycled at 0 to 100 degrees C and -40 to 125 degrees C to evaluate the relative fatigue behavior of the interconnections. Ball attach techniques and module-to-card assembly processes are described, including screening, placement, and reflow. Failure mechanisms and fatigue reliability are discussed for both metallurgies.
引用
收藏
页码：53 / 57
页数：5
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