RELIABILITY COMPARISON OF 2 METALLURGIES FOR CERAMIC BALL GRID ARRAY

被引：12
|
作者：
BANKS, DR
BURNETTE, TE
GERKE, RD
MAMMO, E
MATTAY, S
机构：
[1] Motorola, Inc., Advanced Packaging Technology, Austin, Texas
来源：
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1995年 / 18卷 / 01期
关键词：
D O I：
10.1109/96.365483
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Surface-mountable ceramic ball grid array (CBGA) packages have proven to be attractive in a variety of applications as designers seek to maximize electrical performance, reduce card real estate, and improve manufacturing process yields. In support of the PowerPC(TM) family of microprocessors, 21 mm CBGA packages (256 leads) were used to evaluate two different ball metallurgies-90/10 Pb/Sn and 62/36/2 Sn/Pb/Ag. Test modules were assembled to printed circuit cards and cycled at 0 to 100 degrees C and -40 to 125 degrees C to evaluate the relative fatigue behavior of the interconnections. Ball attach techniques and module-to-card assembly processes are described, including screening, placement, and reflow. Failure mechanisms and fatigue reliability are discussed for both metallurgies.
引用
收藏
页码：53 / 57
页数：5
相关论文
共 50 条
  • [31] Reliability and failure analyses of thermally cycled Ball Grid Array assemblies
    Ghaffarian, R
    Kim, NP
    48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 713 - 720
  • [32] Copper Trace Thermomechanical Reliability Analysis of Ball Grid Array Package
    Shih, Sean
    Lee, Michael Y. C.
    Liao, Tse-Wei
    Liu, D. S.
    Shih, Meng-Kai
    Tamg, David
    Hung, C. P.
    2018 13TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2018, : 58 - 61
  • [33] Effect of PCB finish on the reliability and wettability of ball grid array packages
    Bradley, E
    Banerji, K
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (02): : 320 - 330
  • [34] Advanced CSP and fine pitch ball grid array assembly reliability
    Blackshear, E
    SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM, 1999, : 243 - 248
  • [35] Selective-column ball grid array (BGA) for improved reliability
    Pandey, V
    Frutschy, K
    McCormick, C
    55th Electronic Components & Technology Conference, Vols 1 and 2, 2005 Proceedings, 2005, : 384 - 390
  • [36] Influence of Ball Grid Array Design Parameters on Solder Joint Reliability
    Afripin, Amirul
    Hauck, Torsten
    2022 IEEE 39TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2022,
  • [37] Ceramic Column Grid Array: A High-reliability Approach for Area Array Packaging
    Huang, Yingzhuo
    Jiang, Xueming
    Lin, Pengrong
    Cao, Yusheng
    Lian, Binhao
    Yao, Quanbin
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 929 - 932
  • [38] Ceramic ball grid array for AMD K6 microprocessor application
    Master, RN
    Dolbear, TP
    Cole, MS
    Martin, GB
    48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 702 - 706
  • [39] Thermomechanical behavior of ceramic ball grid array based on experiments and FEM simulations
    Deletage, JY
    Fenech, A
    Bechou, L
    Ousten, Y
    Danto, Y
    Salagoity, M
    Faure, C
    Rao, S
    NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, : 91 - 98
  • [40] Thermal analysis of a flip chip ceramic ball grid array (CBGA) package
    Kandasamy, Ravi
    Mujumdar, A. S.
    MICROELECTRONICS RELIABILITY, 2008, 48 (02) : 261 - 273
12345