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- [2] Lead-free ceramic ball grid array: Thermomechanical fatigue reliability Journal of Electronic Materials, 2003, 32 : 1421 - 1425
- [4] The influence of pad geometry on ceramic ball grid array solder joint reliability NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, : 267 - 273
- [5] Ceramic ball grid array resistor networks 1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1997, 3235 : 529 - 533
- [7] Reliability of plastic ball grid array package IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (01): : 73 - 77
- [8] Evaluation of Lead(Pb)-free ceramic ball grid array (CBGA): wettability, microstructure and reliability 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 978 - 986
- [9] Ceramic Ball Grid Array Package Stress Analysis 3RD ELECTRONIC AND GREEN MATERIALS INTERNATIONAL CONFERENCE 2017 (EGM 2017), 2017, 1885