Degradation Test for an Anodic Aluminum Oxide Film in Plasma Etching

被引:0
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作者
Seung-Su Lee
Min-Joong Kim
Chin-Wook Chung
Je-Boem Song
Seong-Geun Oh
Jin-Tae Kim
Nak-Kwan Chung
Ju-Young Yun
机构
[1] Hanyang University,Department of Electrical Engineering
[2] Hanyang University,Department of Chemical Engineering
[3] Korea Research Institute of Standards and Science,Center for Materials and Energy Measurement
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Plasma etching; Anodic aluminum oxide film; Degradation test; Reliability;
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摘要
A reliability assessment was performed to predict the lifetime of an anodic aluminum oxide film coated on equipment used in plasma etching processes. An anodic aluminum-oxide-coated part was exposed to an argon plasma, and its weight loss was monitored. This plasma test was conducted at four different pressure levels (125, 150, 200, and 250 mTorr). The failure distribution data obtained for each pressure level were found to indicate the same failure mechanism. Subsequently, an inverse power model was the best fit model for describing the relationship between the applied pressure and the lifetime of a part. The failure of the anodic aluminum oxide film caused by long-term exposure to plasma is, thus, shown to be closely linked to a decrease in the weight of the film.
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页码:1046 / 1051
页数:5
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