Mechanical properties of electrodeposited nanocrystalline copper using tensile and shear punch tests

Characterization of the mechanical properties of electrodeposited nanocrystalline Cu with an average grain size of 74 nm was carried out using two different testing techniques, shear punch tests and tensile tests. The grain size distribution was broad and the volume fraction of larger grains was appreciable. The electrodeposited Cu had a high yield strength combined with moderate ductility and strain hardening. Scatter in the ductility values was attributed to residual porosity and inhomogeneity in the microstructure. Measurements of the strain rate sensitivity showed a significant increase in the rate sensitivity and a decrease in the activation volume for the deformation of nanocrystalline Cu compared with similar tests on coarse-grained cold worked Cu.