Mechanical properties of electrodeposited nanocrystalline copper using tensile and shear punch tests

被引：0
|
作者：
Ramesh Kumar Guduru
Kristopher A. Darling
Ronald O. Scattergood
Carl C. Koch
K. L. Murty
机构：
[1] NC State University,Department of Materials Science and Engineering
来源：
Journal of Materials Science | 2007年 / 42卷
关键词：
Strain Rate Sensitivity; Ultimate Stress; Strain Rate Effect; Stress Relaxation Test; Surface Mechanical Attrition Treatment;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Characterization of the mechanical properties of electrodeposited nanocrystalline Cu with an average grain size of 74 nm was carried out using two different testing techniques, shear punch tests and tensile tests. The grain size distribution was broad and the volume fraction of larger grains was appreciable. The electrodeposited Cu had a high yield strength combined with moderate ductility and strain hardening. Scatter in the ductility values was attributed to residual porosity and inhomogeneity in the microstructure. Measurements of the strain rate sensitivity showed a significant increase in the rate sensitivity and a decrease in the activation volume for the deformation of nanocrystalline Cu compared with similar tests on coarse-grained cold worked Cu.
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页码：5581 / 5588
页数：7
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