Advanced Characterization of Pb-Free Interconnects

被引:0
|
作者
Richard Coyle
Babak Arfaei
机构
[1] Nokia Bell Labs Reliability Engineering,Research and Advanced Engineering
[2] Ford Motor Company,Physics Department
[3] Binghamton University,undefined
来源
JOM | 2016年 / 68卷
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:2869 / 2870
页数:1
相关论文
共 50 条
  • [1] Advanced Characterization of Pb-Free Interconnects
    Coyle, Richard
    Arfaei, Babak
    [J]. JOM, 2016, 68 (11) : 2869 - 2870
  • [2] Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging
    Cotts, Eric
    Arfaei, Babak
    [J]. JOM, 2015, 67 (10) : 2381 - 2382
  • [3] Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging
    Eric Cotts
    Babak Arfaei
    [J]. JOM, 2015, 67 : 2381 - 2382
  • [4] Electromigration and Thermal Migration in Pb-free Interconnects
    Lu, Minhua
    Wassick, Thomas
    Advocate, Gerald
    Backes, Ben
    [J]. 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 2036 - 2039
  • [5] Pb-free solders for flip-chip interconnects
    D. R. Frear
    J. W. Jang
    J. K. Lin
    C. Zhang
    [J]. JOM, 2001, 53 : 28 - 33
  • [6] Pb-free solders for flip-chip interconnects
    Frear, DR
    Jang, JW
    Lin, JK
    Zhang, C
    [J]. JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 2001, 53 (06): : 28 - +
  • [7] Electromigration kinetics and critical current of Pb-free interconnects
    Lu, Minhua
    Rosenberg, Robert
    [J]. APPLIED PHYSICS LETTERS, 2014, 104 (14)
  • [8] Nanoindentation study of the Pb-free solders in fine pitch interconnects
    Mohankumar, K
    Tay, AAO
    [J]. 6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 483 - 489
  • [9] Pb-free resistor for Pb-free LTCC system
    Fukaya, M
    Higuchi, C
    [J]. 2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 636 - 641
  • [10] Life expectancies of Pb-free SAC solder interconnects in electronic hardware
    Osterman, Michael
    Dasgupta, Abhijit
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) : 229 - 236