Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging

被引：0
|
作者：
Eric Cotts
Babak Arfaei
机构：
[1] Binghamton University,Physics Department
[2] APL Laboratory,undefined
[3] Universal Instruments,undefined
来源：
JOM | 2015年 / 67卷
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页码：2381 / 2382
页数：1
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