Advanced Characterization of Pb-Free Interconnects

被引:0
|
作者
Richard Coyle
Babak Arfaei
机构
[1] Nokia Bell Labs Reliability Engineering,Research and Advanced Engineering
[2] Ford Motor Company,Physics Department
[3] Binghamton University,undefined
来源
JOM | 2016年 / 68卷
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:2869 / 2870
页数:1
相关论文
共 50 条
  • [41] Temperature-dependent energy storage characterization of Pb-free relaxor ferroelectrics
    Uddin, Sarir
    Zheng, Guang-Ping
    Khan, Asif
    Khan, Muhammad Riaz
    Khan, Banaras
    [J]. JOURNAL OF ADVANCED DIELECTRICS, 2020, 10 (03)
  • [42] Frequency Dependent S-N Curves for Predicting Drop Impact Robustness of Pb-free Solder Interconnects
    Zhao, X. J.
    Caers, J. F. J. M.
    Wong, E. H.
    Seah, S. K. W.
    Driel, W. D. V.
    Owen, N.
    Lai, Yi-Shao
    [J]. 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 93 - +
  • [43] Improving solder joint reliability in Pb-free flip chips with advanced underfill adhesives
    Kanagavel, S
    Painaik, M
    Hurley, JM
    Dhoble, A
    [J]. 55th Electronic Components & Technology Conference, Vols 1 and 2, 2005 Proceedings, 2005, : 1475 - 1479
  • [44] Development Status of High Speed Ball Pull for Pb-Free BGA Characterization
    Hundt, Paul
    Gupta, Vikas
    [J]. 32ND IEEE/CPMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM, 2007, : 121 - 125
  • [45] Fabrication and characterization of Pb-free transparent dielectric layer for plasma display panel
    Song, Joon-Young
    Choi, Se-Young
    [J]. DISPLAYS, 2006, 27 (03) : 112 - 116
  • [46] Pb-free plating for peripheral/leadframe packages
    Nakadaira, Y
    Matsuura, T
    Tsuriya, M
    Vo, ND
    Kangas, R
    Conrad, J
    Sundram, B
    Lee, KH
    Arunasalam, SM
    [J]. SECOND INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING, PROCEEDINGS, 2001, : 213 - 218
  • [47] Electromigration in SnPb and Pb-free solder bumps
    Rinne, GA
    [J]. 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 974 - 978
  • [48] Electrochemical corrosion study of Pb-free solders
    Wu, BY
    Chan, YC
    Alam, MO
    Jillek, W
    [J]. JOURNAL OF MATERIALS RESEARCH, 2006, 21 (01) : 62 - 70
  • [49] Nano and Micro Materials in a Pb-Free World
    Das, Rabindra N.
    Lauffer, John M.
    Knadle, Kevin
    Vincent, Michael
    Poliks, Mark D.
    Markovich, Voya R.
    [J]. 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1228 - 1233
  • [50] Pb-free design and process optimization for PIH
    Fockenberger, H
    Ho, T
    Pfennich, G
    Shangguan, D
    Tat, LC
    [J]. CONNECTOR SPECIFIER, 2005, 21 (10) : 14 - 16