A Survey of Test Techniques for MCM Substrates

被引：0
|
作者：
Madhavan Swaminathan
Bruce Kim
Abhijit Chatterjee
机构：
[1] School of Electrical and Computer Engineering,Department of Electrical Engineering and Computer Science
[2] Georgia Institute of Technology,undefined
[3] Tufts University,undefined
来源：
Journal of Electronic Testing | 1997年 / 10卷
关键词：
multi-chip module; interconnect test; MCM substrates; known-good-die;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
This paper provides a survey of MCM substrate test techniques. Test techniques that are based on capacitance,resistance, electron beam, latent opens, time domain network analysis(TDNA) and RF resonator are discussed. In this paper, test techniquesare applied to interconnect testing.
引用
收藏
页码：27 / 38
页数：11
相关论文
共 50 条
  • [41] Design of test modules for the analysis of MCM interconnects
    Truzzi, C
    Beyne, E
    Ringoot, E
    EUROPEAN DESIGN & TEST CONFERENCE 1996 - ED&TC 96, PROCEEDINGS, 1996, : 614 - 614
  • [42] Stochastic search and graph techniques for MCM path planning
    Piatko, CD
    Diehl, CP
    McNamee, P
    Resch, C
    Wang, IJ
    DETECTION AND REMEDIATION TECHNOLOGIES FOR MINES AND MINELIKE TARGETS VII, PTS 1 AND 2, 2002, 4742 : 583 - 593
  • [43] DU ANTIGEN DETERMINATION USING GROUPAMATIC - COMPARISON WITH MANUAL TECHNIQUES - 203240 TEST SURVEY
    GARRETTA, M
    MULLER, A
    GENER, J
    REVUE FRANCAISE DE TRANSFUSION, 1974, 17 (03): : 211 - 227
  • [44] Aerial oxidation of coal-analytical methods, instrumental techniques and test methods: A survey
    Sen, Raja
    Srivastava, Sunil K.
    Singh, Madan Mohan
    INDIAN JOURNAL OF CHEMICAL TECHNOLOGY, 2009, 16 (02) : 103 - 135
  • [45] Sensors for soil, substrates, and concrete based on the MCM100 microchip
    Balendonck, J
    Hilhorst, MA
    Whalley, WR
    ELECTROMAGNETIC AQUAMETRY: ELECTROMAGNETIC WAVE INTERACTION WITH WATER AND MOIST SUBSTANCES, 2005, : 277 - 315
  • [46] Integrated passive elements on low cost MCM-D substrates
    Grzyb, J
    Cottet, D
    Tröster, G
    2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS, 2001, 4428 : 256 - 261
  • [47] High Q-factor inductors integrated on MCM Si substrates
    Zu, L
    Lu, YC
    Frye, RC
    Lau, MY
    Chen, SCS
    Kossives, DP
    Lin, JS
    Tai, KL
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (03): : 635 - 643
  • [48] New developments in hollow microspheres that may be added to MCM-L and MCM-C substrates for multichip modules
    Kellerman, D
    Tessier, N
    1997 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES - PROCEEDINGS, 1997, : 148 - 153
  • [49] CAD-BASED NET CAPACITANCE TESTING OF UNPOPULATED MCM SUBSTRATES
    MARSHALL, J
    CHONG, FC
    MODLIN, D
    WESTBROOK, S
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (01): : 50 - 55
  • [50] ELECTRICAL TEST OF MULTICHIP SUBSTRATES
    ECONOMIKOS, L
    MORRISON, T
    CRNIC, F
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (01): : 56 - 61
12345