A Survey of Test Techniques for MCM Substrates

被引：0
|
作者：
Madhavan Swaminathan
Bruce Kim
Abhijit Chatterjee
机构：
[1] School of Electrical and Computer Engineering,Department of Electrical Engineering and Computer Science
[2] Georgia Institute of Technology,undefined
[3] Tufts University,undefined
来源：
Journal of Electronic Testing | 1997年 / 10卷
关键词：
multi-chip module; interconnect test; MCM substrates; known-good-die;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
This paper provides a survey of MCM substrate test techniques. Test techniques that are based on capacitance,resistance, electron beam, latent opens, time domain network analysis(TDNA) and RF resonator are discussed. In this paper, test techniquesare applied to interconnect testing.
引用
收藏
页码：27 / 38
页数：11
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