Microstructure and mechanical properties predicted by indentation testing of lead-free solders

被引：0
|
作者：
T. Ogawa
R. Kaga
T. Ohsawa
机构：
[1] Aoyama Gakuin University,Department of Mechanical Engineering
来源：
Journal of Electronic Materials | 2005年 / 34卷
关键词：
Lead-free solder; indentation method; mechanical properties; elastic; plastic; creep; microstructure;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Microstructure and mechanical properties were investigated for ten systems of lead-free solders compared with the eutectic Sn-Pb solder. Mechanical properties including elastic, plastic, and creep deformations were predicted by indentation testing. This method was established based on the elastic-plastic-creep finite-element method (FEM). The predicted mechanical properties were obtained for the temperatures ranging between −20°C and 160°C.
引用
收藏
页码：311 / 317
页数：6
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