Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders

被引：0
|
作者：
KANLAYASIRI, Kannachai [1 ]
MOOKAM, Niwat [2 ]
机构：
[1] Department of Industrial Engineering, School of Engineering, King Mongkut's Institute of Technology Ladkrabang, Bangkok,10520, Thailand
[2] Department of Industrial and Production Engineering, Faculty of Industry and Technology, Rajamangala University of Technology Rattanakosin Wang Klai Kangwon Campus, Prachuapkhirikhan,77110, Thailand
来源：
Transactions of Nonferrous Metals Society of China (English Edition) | 2022年 / 32卷 / 04期
关键词：
All Open Access; Gold;
D O I：
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摘要：
45
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页码：1226 / 1241
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