AI chips that flip

被引：0

作者：

Stuart Thomas

机构：

[1] Nature Electronics,

来源：

Nature Electronics | 2023年 / 6卷

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：178 / 178

共 50 条

[1] AI chips that flip
Thomas, Stuart
[J]. NATURE ELECTRONICS, 2023, 6 (03) : 178 - 178
[2] Flip chips - Finally?
Micronsult
[J]. Adv Microelectron, 2008, 5 (06):
[3] HOW FLIP CHIPS INTERCONNECT
WOOD, JR
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1971, 50 (09): : 758 - &
[4] Various adhesives for flip chips
Zhong, ZW
[J]. JOURNAL OF ELECTRONIC PACKAGING, 2005, 127 (01) : 29 - 32
[5] Flip chips on leadframes for fast apps
不详
[J]. SOLID STATE TECHNOLOGY, 2001, 44 (07) : 42 - +
[6] Delamination cracking in encapsulated flip chips
LeGall, CA
Qu, JM
McDowell, DL
[J]. 46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS, 1996, : 430 - 434
[7] Nanobump flip chips: Realizing the advantages
[J]. Advanced Packaging, 2007, 16 (03): : 18 - 20
[8] Flip chips on leadframes for fast apps
Anon
[J]. 2001, PennWell Publishing Co. (44)
[9] Laser soldering of flip-chips
Kordás, K
Pap, AE
Tóth, G
Pudas, M
Jääskeläinen, J
Uusimäki, A
Vähäkangas, J
[J]. OPTICS AND LASERS IN ENGINEERING, 2006, 44 (02) : 112 - 121
[10] AI chips: Challenges and opportunities
Singer, Pete
[J]. SOLID STATE TECHNOLOGY, 2018, 61 (07) : 23 - 24